AI 3D SPI True 3D+AI Detects All Defects At One Time SMT Equipment

AI 3D SPI True 3D+AI detects all defects at one time SMT Equipment

1.The latest self-developed AAM absolute precision measuring system,accurate detection of poor pad printing of 0201 mm components.
2.High-precision automatic Z-axis module, capable of adapting to various complex processes
3.Can be integrated with MES according to factory requirements.
4.Prweful SPC software provides rich and accurate data statistics.
5.Integrated casting,high-rigidity platforrm

True 3D Detection
Small angle 2-way projection system,eliminate small spacing occlusion to a greater extent 
Breakthrough Morie fringe algorithm to further reduce CT time

3D Inspection effect

Common defects
1.Excess solder 2.Print leakage 3.Skew 4.Short circuit
5.Short circuit 6.Insufficient solder 7Irregular soledr paste 8.Odd-shaped

AI Detectable defects
1.Gold surface scratch 2.Gold surface contamination 3.Excess solder
4.Copper Leakage 5.Qxidation 6.Foreign material